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M-Bond 610 Adhesive Used on WK-Series Strain Gage (Training Video)
The recommended procedures and materials needed for bonding a Micro-Measurements WK-Series strain gage with Option W using M-Bond 610 Adhesive are covered in this video.

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Overview of Micro-Measurements StrainSmart Data Systems and Software for data acquisition, conditioning, reduction, and presentation of measurement data from strain gages and related sensors for stress analysis and structural materials testing.

The recommended procedures and materials needed for bonding a Micro-Measurements WK-Series strain gage with Option W using M-Bond 610 Adhesive are covered in this video.

The recommended procedures and materials needed for attaching leadwires to a Micro-Measurements CEA strain gage and applying a coating to the gage to protect it in the laboratory environment are covered in this video. Although soldering is basically a simple procedure, the experience-proven methods featured in this video result in reliable strain gage installations based on the use of Micro-Measurements gages and installation accessories

Micro-Measurements CEA-Series gages are the most widely accepted for use in general-purpose experimental stress analysis applications in the world today. These polyimide encapsulated constantan gages feature large, rugged copper-coated tabs. This construction provides optimum capability for attaching leadwires directly to the tabs, eliminating the need for separate terminals. Micro-Measurements Certified M-Bond 200 is an excellent general-purpose laboratory adhesive because of its fast room-temperature cure and ease of application. For proper results, the procedures and techniques presented here should be used with qualified Micro-Measurements installation accessory products.

Strain gages can be satisfactorily bonded to almost any solid material if the material surface is properly prepared. While a properly prepared surface can be achieved in more than one way, the specific procedures and techniques described here offer a number of advantages. To begin with, they constitute a carefully developed and thoroughly proven system; and, when the instructions are followed precisely (along with those for gage and adhesive handling), the consistent result will be strong stable bonds. The procedures are simple to learn, easy to perform, and readily reproducible. The importance of attention to detail, and precise adherence to instructions, cannot be overstressed in surface preparation for strain gage bonding.

Micro-Measurements offers a series of regularly scheduled seminars, workshops, and short courses. These are taught by members of our staff who are recognized authorities in their field. Pertinent details of the available programs are covered in the video along with a preview of our Technical Training Center near Raleigh, North Carolina, USA.

Micro-Measurements’ System 8000 is a data acquisition system that communications via a high-speed Ethernet connection to your PC or laptop. Each scanner has eight software-selectable input channels capable of acquiring data from a strain gage based device, a thermocouple, or a high-level device. The channel count can be expanded to 128-channel system with additional scanners. Optional self-calibration functionality is available.

Strain gages from Micro-Measurements, a Vishay Precision Group (VPG) brand, are used by the University of Florida SAE Formula Team to validate that new airfoil designs are producing the downforce required to improve cornering. Higher downforce improves corner traction, which results in higher G forces and therefore higher corner speeds to provide a competitive advantage.

Donielle Dockery provides a brief introduction to the StudentDAQ. The Student Data Acquisition Device is a single-channel, USB-powered measurement device for use with resistive strain gages (strain gauges). Internal bridge completion supports full-, half-, and quarter-bridge configurations. This device is designed for use in applications where a convenient, low-cost, easy-to-use strain gage (strain gauge) measurement is required. It is ideal for classroom environments or gage installation verification.

Darryl Peterson provides a brief introduction to the hole-drilling method of determining residual stress. These stresses can be beneficial or detrimental to the survivability of a part subjected to service loads, and can be inadvertently caused by machining, welding, and assembly processes, or intentionly developed using techniques like shotpeening. Darryl also gives a thorough description of each critical component that makes up the RS-200 milling guide, the device used for introducing the required precison hole into the test specimen. Details for this technique can be found in the ASTM standard, E 837.